Shenhua Printing Plate and Die Pad Anti-Slip Pad: Special dual-advantage solution for humid and high-temperature workshops, with excellent heat resistance and moisture-proof properties.

Damp and hot workshops (such as those in southern summer areas, food processing auxiliary die-cutting workshops, and chemical packaging workshops) have an ambient temperature of over 35℃ and a humidity of over 85%. Regular die-cutting pad liners are prone to problems such as gel softening, elasticity decline, back adhesive detachment, and surface mold growth, which can lead to incomplete die-cutting, pad displacement, production interruption, and difficulty in adapting to the harsh conditions of damp and hot environments. Deephua Printing Materials focuses on the pain points of damp and hot scenarios, optimizes materials and back adhesive formulations, and creates dual-optimized dedicated die-cutting pad liners that are resistant to temperature and moisture, achieving long-term stable die-cutting in high-temperature and high-humidity environments.

In the development of temperature-resistant and moisture-proof materials, a composite elastic material resistant to high temperatures and moisture is used, with added components resistant to high temperatures and softening and efficient moisture-proof agents. The molecular chain structure of the material is reconstructed, enabling the pad to work normally in a temperature range of 35℃ - 60℃ without softening or elasticity decline, with an elasticity retention rate of over 92%. The material's density is enhanced, forming a moisture-proof isolation layer, preventing moisture from penetrating in an environment with a humidity of 85% - 95%, and without mold growth or swelling. Anti-aging components are added to resist the erosion of the material by high-temperature and high-humidity environments, extending the service life.

In the optimization of back adhesives and structure, custom high-temperature and high-humidity-specific back adhesives are used. The high-temperature and high-humidity-resistant adhesion strengthening technology is adopted, allowing the pad to firmly adhere to the die-cutting plate even in a 60℃ high-temperature and high-humidity environment, with the peel strength of the back adhesive being 55% higher than that of conventional back adhesives, avoiding pad displacement, detachment, and blistering. The surface of the pad is treated with anti-slip and anti-fog processing to reduce the adhesion of packaging materials caused by damp and hot conditions, and additional heat dissipation and air duct patterns are added to guide the surface heat and moisture to quickly evaporate, avoiding interference with die-cutting accuracy. A 1.5 - 3.0mm common thickness specification is launched, suitable for different die-cutting requirements in various scenarios, with a thickness error controlled within ±0.04mm. After applying this solution to a southern food processing enterprise, the pad replacement cycle in damp and hot workshops was extended from 4 days to 18 days, the detachment rate was reduced from 13% to 0.5%, the defective die-cut rate was decreased from 9% to 0.6%, completely solving the die-cutting problems in high-temperature and high-humidity environments.