Shenhua Printing Material Knife Plate Spring Pad: Special Anti-static High-Precision Solution for Electronic Label Precision Die-cutting

Electronic tags (such as RFID tags, NFC tags, and precision electronic tags) have the characteristics of small size, thin traces, and high precision requirements. They also need to have anti-static performance to prevent static adsorption of dust and damage to the internal chips. Conventional spring pads have insufficient precision and poor anti-static performance, which often result in problems such as burrs on the knife lines, size deviations, and static adsorption, making it difficult to meet the strict die-cutting requirements of electronic tags. Shenhua Printing Materials focuses on the pain points of electronic tag die-cutting and creates anti-static high-precision special spring pad templates to achieve efficient and precise die-cutting of electronic tags.

In terms of precision optimization, a nano-level high-density forming process is adopted, with the thickness error of the spring pad controlled within ±0.01mm, and the hardness fluctuation of the same plate surface ≤1 Shore A. It can meet the die-cutting requirements of electronic tags with fine knife lines (knife line width ≤0.3mm), ensuring precise die-cutting dimensions, neat edges without burrs; the selected high-rebound homogeneous base material has a rebound rate of over 98%, and the compression permanent deformation rate ≤2%, with uniform pressure transmission, avoiding label damage and chip damage caused by excessive local pressure.

In terms of anti-static and anti-adhesion design, the spring pad material is added with an efficient anti-static agent, with the surface resistance value stable at 10^6 - 10^9Ω, which can effectively eliminate static generated during die-cutting, avoiding static adsorption of dust and damage to the chips; the surface adopts a special low-friction anti-adhesion coating, with a friction coefficient of less than 0.05, reducing the adhesion between the label and the spring pad, improving the waste removal efficiency, and avoiding coating migration and contamination of the label; a 0.3 - 0.7mm ultra-thin spring pad is launched, suitable for thin base materials of electronic tags (such as PET film, copper foil base material), avoiding material stretching deformation. After an electronic tag enterprise applied this solution, the defective rate of electronic tag die-cutting decreased from 7% to 0.1%, the static damage to the chips was almost zero, the size deviation was controlled within ±0.03mm, and it fully met the production requirements of precision electronic tags.