Shenhua Printing Plate and Die Pad Anti-Dew Point and Anti-Detachment Solution for High-Humidity Environments

High humidity environments (such as the rainy season in the south, aquatic product processing workshops, and the auxiliary die-cutting workshop in refrigerated warehouses) often have air humidity levels exceeding 85%. Regular die-cutting pads are prone to problems such as gel softening, back adhesive detachment, elastic attenuation, and surface mold growth, which can lead to incomplete die-cutting, pad displacement, production interruptions, and difficulty in meeting the production requirements of high humidity environments. Deephua Printing Materials focuses on the pain points of die-cutting in high humidity environments, optimizes the material and back adhesive formula, and creates high humidity-specific die-cutting pad, achieving long-term stable die-cutting in high humidity environments.

In the development of moisture-proof materials, a moisture-proof and moisture-resistant composite rubber formula is adopted, with moisture-proof agents and anti-softening components added to enhance the moisture-proof performance of the pad, avoiding gel softening and elastic attenuation caused by high humidity environments. In an environment with a humidity of 85% - 95%, the rebound rate of the pad remains above 92%, and the compression permanent deformation rate is ≤ 6%. There is no softening or mold growth. The material's density is optimized to form a moisture-proof isolation layer, blocking the penetration of moisture in the air, delaying the aging speed of the pad, and extending its service life.

In the optimization of back adhesives, high humidity-specific moisture-proof back adhesives are customized. The moisture-proof adhesion strengthening technology is adopted, ensuring a firm adhesion to the die-cutting pad in high humidity environments. The peel strength is 50% higher than that of conventional back adhesives, avoiding pad displacement, detachment, and blistering. The surface of the back adhesive is treated with a moisture-proof coating to prevent erosion by moisture and ensure a stable overall adhesion. In the structural design, the surface of the pad is treated with anti-slip and anti-fog processing to reduce packaging material adhesion in high humidity environments. At the same time, drainage patterns are added to guide surface water vapor to evaporate quickly, avoiding the influence of water vapor on die-cutting accuracy. After a certain aquatic product packaging enterprise in the south applied this solution, the pad replacement cycle in high humidity environments was extended from 5 days to 20 days, the detachment rate was reduced from 12% to 0.5%, the defective die-cut rate was reduced from 8% to 0.6%, completely solving the die-cutting problems in high humidity environments.