Shenhua Printing Material Knife Plate Spring Pad: Special Anti-static and Dust-Free Solution for Precision Electronic Packaging and Die-cutting

Precision electronic packaging (such as chip packaging, electronic component trays, data cable packaging) has extremely strict requirements for die-cutting environment, consumable cleanliness, and anti-static performance. Conventional spring clips are prone to generating static electricity and shedding dust, which can adhere to the surface of electronic components, causing short circuits and failures of the components. At the same time, dust pollution will affect the packaging cleanliness and is difficult to meet the compliance requirements of the electronic industry. Shenghua Printing Materials focuses on the pain points of precision electronic packaging and has developed special anti-static and dust-free knife plate spring clips. From the material, production, and process full-chain control, it is suitable for the strict requirements of precision electronic packaging.

In terms of anti-static and cleanliness control, the selected anti-static and dust-free elastic material is added with efficient anti-static agents, making the surface resistance value stable between 10^6 - 10^9 Ω. This can effectively eliminate static electricity generated during die-cutting and prevent static electricity from adsorbing dust and electronic components. The material uses a no-fill and no-powdering formula, eliminating dust shedding during use. The production process is completed in a 10,000-level cleanroom, with no bacterial or dust pollution throughout the process. The cutting adopts a low-temperature precision cutting process to avoid micro-shavings caused by high temperature, and the edges are treated with blunting and sealing processing to completely prevent chipping and fraying.

In terms of performance and accuracy, the spring clip uses a high-density homogeneous base material, with an elasticity recovery rate of over 97%, a compression permanent deformation rate of ≤ 3%, and a thickness error controlled within ±0.02mm. It can meet the precise knife lines and irregular die-cutting requirements of precision electronic packaging. The surface adopts a low-friction anti-adhesion coating to reduce friction with packaging materials, avoid damage to the materials, and improve the waste removal efficiency. It ensures that the cutting edges are neat and without burrs. The backing adhesive used is an anti-static low-extraction backing adhesive, which has no residual glue or fogging volatilization after application, and will not contaminate electronic components. After a certain precision electronic enterprise applied this solution, the dust pollution rate of electronic packaging die-cutting dropped to below 0.01%, and there were no cases of component failures caused by static electricity. It successfully passed the electronic industry clean production audit.