Shenhua Printing Material Knife Plate Spring Pad: A universal equal-pressure matching solution for large-sized die-cutting areas

Low-temperature refrigeration die-cutting scenarios (such as refrigerated food packaging, cold chain logistics packaging die-cutting), with low environmental temperature (-10℃ to 0℃) and high humidity, conventional die-cutting pads are prone to problems such as gel hardening, cracking, back adhesive loss of adhesion, and elastic attenuation, resulting in incomplete die-cutting, material damage, pad detachment, and inability to meet the production requirements of low-temperature refrigeration. Deephua Printing Materials has optimized the material and back adhesive formula to create a dedicated die-cutting pad for low-temperature refrigeration, achieving long-term stable die-cutting in low-temperature and high-humidity environments.

In terms of low-temperature material research and development, a hydrogenated nitrile rubber and low-temperature elastomer blended modified material is used, combined with low-temperature toughening agents, to reconstruct the molecular chain structure of the material, enabling the pad to work normally in the -15℃ to 0℃ low-temperature environment without hardening or cracking, with a rebound rate of over 90%, and a compression permanent deformation rate of ≤6%, far exceeding the industry standards for low-temperature pads. At the same time, moisture-proof components are added to enhance the pad's moisture resistance, avoiding gel swelling and elastic attenuation caused by high humidity environments, and maintaining stable performance even in environments with a relative humidity of 80% or above.

In terms of back adhesive optimization, custom low-temperature and high-humidity-specific back adhesives are used, employing low-temperature adhesive strength enhancement technology, which can still firmly adhere to the die-cutting pad in the -10℃ environment, with the peel strength of the back adhesive being 45% higher than that of conventional back adhesives, avoiding pad displacement and detachment; the back adhesive has moisture-proof properties, preventing back adhesion loss and blistering caused by high humidity environments. In response to the hygiene requirements of refrigerated food packaging, the pad material complies with food-grade standards, has no odor or harmful residues, and has passed FDA certification, and can be directly used for die-cutting of food packaging.

After a certain refrigerated food packaging enterprise applied this solution, the defective rate of low-temperature refrigeration die-cutting decreased from 12% to 0.7%, and the pad replacement cycle was extended to 20 days, completely solving the die-cutting problems in low-temperature and high-humidity environments, ensuring the production efficiency and quality of refrigerated food packaging.