Shenhua Printing Material Knife Plate Spring Pad: An Adaptation Solution for Low Temperature and High Humidity Environments in Die-cutting Scenarios

Low-temperature refrigeration die-cutting scenarios (such as refrigerated food packaging, cold chain logistics packaging die-cutting), with low environmental temperature (-10℃ to 0℃) and high humidity, conventional die-cutting pads are prone to problems such as gel hardening, cracking, back adhesive loss of adhesion, and elastic attenuation, resulting in incomplete die-cutting, material damage, pad detachment, and inability to meet the production requirements of low-temperature refrigeration. Deephua Printing Materials has optimized the material and back adhesive formula to create a dedicated die-cutting pad for low-temperature refrigeration, achieving long-term stable die-cutting in low-temperature and high-humidity environments.

In terms of low-temperature material research and development, a modified material made by blending hydrogenated nitrile rubber with low-temperature elastomers, combined with low-temperature toughening agents, reconstructs the molecular chain structure of the material, enabling the pad to work normally in the low-temperature environment of -15℃ to 0℃, without hardening or cracking, with a rebound rate of over 90%, and a compression permanent deformation rate of ≤6%, far exceeding the industry standards for low-temperature pads. At the same time, adding moisture-proof components enhances the pad's moisture resistance, preventing gel swelling and elastic attenuation caused by high humidity, and maintaining stable performance even in environments with a relative humidity of 80% or above.

In terms of back adhesive optimization, custom-made back adhesives for low-temperature and high-humidity conditions are used, employing low-temperature adhesive strengthening technology, which can still firmly adhere to the die-cutting pad in the -10℃ environment, with the peel strength of the adhesive being 45% higher than that of conventional adhesives, preventing pad displacement and detachment; the adhesive has moisture-proof properties, preventing adhesive loss and blistering caused by high humidity, and maintaining stable performance even in environments with a relative humidity of 80% or above.

In terms of die-cutting pad material, the pad material meets food-grade standards, has no odor or harmful residues, and has passed FDA certification, allowing it to be directly used for die-cutting of food packaging.

After a certain refrigerated food packaging enterprise applied this solution, the defective rate of low-temperature refrigeration die-cutting decreased from 12% to 0.7%, and the pad replacement cycle was extended to 20 days, completely solving the die-cutting problems in low-temperature and high-humidity conditions, ensuring the production efficiency and quality of refrigerated food packaging.