Shenhua Printing Plate and Die Pad Dust-Proof Cushion: Special Low-Dust and Low-Volatile Adaptation Solution for Dust-Free Cleanrooms

In production processes such as packaging of electronic components, medical consumables, and precision optics, ten-thousand-level and thousand-level dust-free cleanrooms are generally required. Commonly used cutting plates and spring pads have problems such as dust shedding, small molecule volatilization, debris falling off, and release of backing adhesives, which can damage the cleanliness and contaminate the products, and even lead to non-compliance of customer production line cleanliness testing. Shenghua Printing Materials has specially developed dust-free dedicated cutting plate spring pads for cleanroom scenarios. The entire chain from raw materials, production, and post-processing controls dust and volatile substances to meet high cleanliness production requirements.

The raw material end selects food and medical grade elastic substrates without filler release and low fogging. It does not use easily powdering fillers, low molecular plasticizers, and odor-causing additives, eliminating problems of debris shedding, powdering, and volatile odors during use from the source. The production process is completed in a thousand-level cleanroom for mixing, pressing, cutting, and finished product packaging. The entire process avoids external dust adhesion. Cutting uses a low-temperature precision cutting process to avoid micro-shavings caused by high-temperature melting. The edges are treated with blunting and sealing to prevent edge chipping and fraying. After processing, vacuum clean dusting and VOCs pre-treatment are carried out to make the spring pads reach low volatility, low odor, and low shedding levels.

In terms of performance, this spring pad maintains high elasticity and dimensional accuracy. The rebound rate is ≥ 95%, and the thickness tolerance is ±0.02mm, meeting the requirements of precision die-cutting. The surface is treated with anti-static and clean processing to reduce static adsorption of micro-dust in the workshop, and it does not produce secondary pollution itself. The backing adhesive used in conjunction is a low-release clean pressure-sensitive adhesive. After application, there is no residual adhesive migration or odor volatilization, and it is suitable for long-term continuous production in the cleanroom. After being used by multiple medical and electronic packaging enterprises, the suspended particle detection rate in the workshop remains at 100%. There are no product contamination or alarm issues caused by the spring pad, and it successfully passes GMP and cleanroom audits.