Shenhua Printing Plate Knife Pad: Optimized Anti-static Performance and Precise Adaptation for Electronic Packaging Scenarios

The packaging of electronic components has strict requirements for the anti-static performance of die-cutting consumables. Conventional die-cutting pads are prone to generating static electricity due to friction during the die-cutting process, which causes dust particles to adhere to the surface of the electronic packaging film, thereby affecting the assembly yield and usage safety of electronic components. Shenhua Printing Materials focuses on this specific scenario of electronic packaging and, through material formulation and process optimization, has developed anti-static-specific die-cutting pad materials to address the issue of static interference.

In terms of anti-static technology, Shenhua Printing Materials has abandoned the short-term solution of "surface spraying anti-static agents" and adopted a modified anti-static material blending technology. It uniformly integrates permanent anti-static agents into the rubber matrix to form a stable conductive path, ensuring that the surface resistance value of the pad is stably controlled at 10

6

-10 9

Between Ω, it complies with the anti-static standards for the electronics industry. At the same time, the surface roughness of the shock-absorbing pads has been optimized, reducing the friction coefficient to below 0.15. This reduces the possibility of friction-induced static electricity at its source. Compared to conventional shock-absorbing pads, the anti-static shock-absorbing pads have an electrostatic attenuation time of less than 2 seconds, which can quickly dissipate the static electricity generated during die-cutting and prevent dust adsorption.

Due to the ultra-thin and highly transparent characteristics of the electronic packaging film, Shenhua Printing Materials has simultaneously optimized the thickness and rebound performance of the anti-static shock-absorbing pads, launching ultra-thin products ranging from 0.3 to 0.8mm. The thickness error is controlled within ±0.02mm, ensuring uniform transmission of die-cutting pressure and avoiding film stretching deformation or damage. Application data from an electronic component packaging enterprise shows that after using this anti-static shock-absorbing pad, the dust adsorption rate on the packaging film surface decreases by 90%, and the assembly yield of electronic components increases from 92% to 99.2%, fully meeting the strict production requirements of the electronics industry. In addition, the anti-static shock-absorbing pad has passed the anti-static detection certification for the electronics industry and has become the designated consumable for many electronic packaging enterprises.